Industrialization of a Process Innovation: The Economic Feasability of Aluminum Bumps in Semiconductor Integrated Circuits.
Details
Serval ID
serval:BIB_166AAB36FC73
Type
A Master's thesis.
Publication sub-type
Master (thesis) (master)
Collection
Publications
Institution
Title
Industrialization of a Process Innovation: The Economic Feasability of Aluminum Bumps in Semiconductor Integrated Circuits.
Institution details
ETHZ (Eidgenössische Technische Hochschule Zürich)
Publication state
Accepted
Issued date
2002
Genre
Master Thesis
Notes
6.0 = Summa cum laude
Keywords
Aluminum Bumps, Economic Feasability, Process Innovation.
Create date
26/11/2008 12:25
Last modification date
20/08/2019 13:46
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