Industrialization of a Process Innovation: The Economic Feasability of Aluminum Bumps in Semiconductor Integrated Circuits.
Détails
ID Serval
serval:BIB_166AAB36FC73
Type
Mémoire
Sous-type
(Mémoire de) maîtrise (master)
Collection
Publications
Institution
Titre
Industrialization of a Process Innovation: The Economic Feasability of Aluminum Bumps in Semiconductor Integrated Circuits.
Détails de l'institution
ETHZ (Eidgenössische Technische Hochschule Zürich)
Statut éditorial
Acceptée
Date de publication
2002
Genre
Master Thesis
Notes
6.0 = Summa cum laude
Mots-clé
Aluminum Bumps, Economic Feasability, Process Innovation.
Création de la notice
26/11/2008 12:25
Dernière modification de la notice
20/08/2019 13:46