Industrialization of a Process Innovation: The Economic Feasability of Aluminum Bumps in Semiconductor Integrated Circuits.

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Serval ID
serval:BIB_166AAB36FC73
Type
A Master's thesis.
Publication sub-type
Master (thesis) (master)
Collection
Publications
Title
Industrialization of a Process Innovation: The Economic Feasability of Aluminum Bumps in Semiconductor Integrated Circuits.
Author(s)
Mezzour S., Lehmann A.
Institution details
ETHZ (Eidgenössische Technische Hochschule Zürich)
Publication state
Accepted
Issued date
2002
Genre
Master Thesis
Notes
6.0 = Summa cum laude
Keywords
Aluminum Bumps, Economic Feasability, Process Innovation.
Create date
26/11/2008 11:25
Last modification date
20/08/2019 12:46
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